The 6th International Conference on 3D Imaging Technologies - Multidimensional Signal Processing and Deep Learning
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Nov 22, 2024 Nov 24, 2024
E-mail:
ic3dit@163.com
The 6th International Conference on 3D Imaging Technologies - Multidimensional Signal Processing and Deep Learning (3DIT-MSP&DL2024) will be held on Nov 22-24, 2024 in Sanya, China.The 3DIT-MSP&DL2024 aims to provide a forum that brings together researchers and academia as well as practitioners from industry to meet and exchange their ideas and recent research development work on all aspects of Images, their applications and other related areas. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. A key aspect of this conference is the strong mixture of academia and industry. This conference brings the experts, practitioners, scientists and decision-makers from academia and industry together. Our aim is to foster a strong, lively and well-connected international research community. We welcome innovative ideas, concepts, services, techniques, research outputs and business practices. |  |
Opening Date Jul 15, 2024 | Submission Deadline Aug 1, 2024 | Notification Sept 15, 2024 | Camera Ready Oct 15, 2024 | Conference Date Nov 22-24, 2024 |
All accepted papers of 3DIT-MSP&DL 2024 will be published in Smart Innovation, Systems and Technologies （ISSN: 2190-3018）by Springer.
1. Presentation & Publication
1) Full Papers will be invited to give the presentation,and the paper will be published in the 3DIT-MSP&DL2024 conference proceedings.
2) English is the official language of the conference; the paper should be written and presented only in English.
3) Each paper should be at least 10 pages or longer.
Template(Word)
